Catalog

Engineered Products

A comprehensive portfolio of precision-engineered diamond wafers, plates, and composites. Ready for direct integration into your manufacturing pipeline or custom-grown to your exact specifications.

Thermal Grade Polycrystalline CVD Diamond

Diameter: Up to 200mm (8 inches) | Thickness: 100μm to 2.5mm

Engineered specifically for extreme heat spreading applications, our Thermal Grade Polycrystalline CVD Diamond offers an unparalleled combination of thermal conductivity and large-area scalability. Grown in proprietary microwave plasma reactors, these wafers are devoid of the metallic binders found in HPHT diamonds. They act as the ultimate heat sink for high-power electronics, laser diode arrays, and dense computing architectures, allowing devices to operate at significantly higher power levels without thermal degradation.

Specs & Tolerances

  • Thermal Conductivity: 1000 - 2000 W/m·K
  • Dielectric Constant: 5.7
  • Electrical Resistivity: > 10¹³ Ω·cm
  • Surface Roughness (Ra): < 10nm (after CMP)

Material Properties

  • Isotropic thermal properties across the wafer
  • Chemically inert and biocompatible
  • Exceptional mechanical strength and hardness

Key Advantages

  • Reduces junction temperatures in high-power chips
  • Allows for massive increases in component packing density
  • Eliminates the need for bulky, active cooling systems

Optical Grade Polycrystalline CVD

Diameter: Up to 125mm (5 inches) | Thickness: 300μm to 3.0mm

Designed for applications requiring maximum light transmission across a broad spectrum, our Optical Grade Polycrystalline Diamond is synthesized with an extremely low nitrogen content. This results in a material with exceptional transparency from the deep ultraviolet to the far infrared and microwave bands. It is the material of choice for high-power CO2 laser windows, multispectral imaging systems, and gyrotron windows where both optical clarity and thermal shock resistance are mandatory.

Specs & Tolerances

  • Optical Transmission: > 70% @ 10.6μm (uncoated)
  • Absorption Coefficient: < 0.05 cm⁻¹ @ 10.6μm
  • Thermal Shock Parameter: 10⁷ W/m
  • Refractive Index: 2.38

Material Properties

  • Broadband optical transparency
  • Immune to thermal shock fracturing
  • Highly resistant to abrasive and corrosive environments

Key Advantages

  • Enables higher power output in industrial lasers
  • Reduces optical distortion caused by thermal lensing
  • Protects sensitive sensor payloads in harsh environments

Electronic Grade Single-Crystal Diamond

Dimensions: Up to 10x10mm plates | Thickness: 50μm to 1.5mm

For the most demanding active semiconductor applications, grain boundaries are unacceptable. Our Electronic Grade Single-Crystal Diamond plates are grown via a highly controlled homoepitaxial CVD process, resulting in a virtually defect-free lattice. With ultra-low impurity levels of nitrogen and boron, these plates provide the highest possible charge carrier mobility, making them ideal for high-power, high-frequency RF devices, high-voltage switches, and extreme-environment detectors.

Specs & Tolerances

  • Nitrogen Concentration: < 5 ppb
  • Dislocation Density: < 10⁴ cm⁻²
  • Electron Mobility: > 3800 cm²/V·s
  • Hole Mobility: > 3000 cm²/V·s

Material Properties

  • Zero grain boundaries
  • Maximum theoretical thermal conductivity (>2200 W/m·K)
  • Ultra-wide bandgap (5.45 eV)

Key Advantages

  • Enables true diamond-based active electronics
  • Supports massive breakdown voltages for power grids
  • Flawless performance in high-radiation environments

Quantum Grade Single-Crystal Diamond

Dimensions: 2x2mm to 5x5mm | Thickness: 100μm to 500μm

The backbone of the coming quantum revolution. Nanomine's Quantum Grade Diamond is meticulously engineered to host Nitrogen-Vacancy (NV) centers—precise atomic defects that function as robust qubits. By utilizing isotopically purified Carbon-12 during the CVD growth phase, we eliminate the nuclear spin interference caused by Carbon-13 isotopes. This results in incredibly long spin coherence times at room temperature, paving the way for scalable quantum computers and ultra-sensitive magnetic and electric field sensors.

Specs & Tolerances

  • NV Center Concentration: Custom (1 ppb to 10 ppm)
  • Carbon-12 Isotopic Purity: > 99.999%
  • Spin Coherence Time (T2): > 2ms at room temp
  • Orientation: (100) or (111) available

Material Properties

  • Stable, optically addressable spin states
  • Extremely low magnetic noise environment
  • Room-temperature quantum operation

Key Advantages

  • Eliminates the need for cryogenic cooling for qubits
  • Enables highly sensitive nanoscale magnetometry
  • Provides a reliable, solid-state platform for quantum networks

Boron-Doped Diamond (BDD)

Format: Free-standing plates or coated on substrates (Nb, Si, Ti)

By intentionally introducing boron gas during the CVD growth process, we transform diamond from a perfect insulator into a highly conductive electrode material. Boron-Doped Diamond (BDD) possesses the widest electrochemical potential window of any known electrode material, combined with total chemical inertness. This makes it a revolutionary component for advanced wastewater treatment (generating hydroxyl radicals to destroy PFAS/forever chemicals), electrochemical sensing, and severe-environment electrosynthesis.

Specs & Tolerances

  • Boron Doping Level: 100 to 10,000 ppm
  • Electrical Resistivity: 0.1 to 0.001 Ω·cm
  • Potential Window: ~3.5 V in aqueous solutions
  • Background Current: Extremely low

Material Properties

  • Metallic-level electrical conductivity
  • Complete resistance to corrosive acids and bases
  • Resistant to bio-fouling and scaling

Key Advantages

  • Destroys complex organic pollutants efficiently
  • Lasts orders of magnitude longer than lead-oxide electrodes
  • Provides highly accurate electrochemical sensing metrics

GaN-on-Diamond / Diamond & Copper Composite Wafers

Wafer Diameter: 3-inch or 4-inch standard formats

Gallium Nitride (GaN) HEMTs are the standard for high-power RF communications, but their power density is fundamentally capped by the poor thermal conductivity of their underlying silicon or SiC substrates. Nanomine's GaN-on-Diamond and Diamond-Copper technology solves this by chemically bonding high-conductivity heat spreaders directly to power modules. This intimate contact removes the thermal bottleneck, allowing RF devices in 5G/6G base stations and military radars to operate at power levels previously thought impossible.

Specs & Tolerances

  • Epitaxial Layer: Standard AlGaN/GaN HEMT structure
  • Diamond Thermal Conductivity: > 1500 W/m·K
  • Thermal Boundary Resistance: < 10 m²·K/GW
  • Wafer Bow: < 30μm

Material Properties

  • Combines GaN/Copper's traits with Diamond's thermal traits
  • Minimizes distance between heat generation and heat sink
  • Stress-managed composite interface

Key Advantages

  • Increases max power density by up to 300%
  • Reduces overall device size and weight
  • Extends the operational life of base station amplifiers

Ultra-High Purity Epitaxial Layers

Deposition Thickness: 1μm to 100μm+ custom

For clients developing proprietary semiconductor architectures, we offer ultra-high purity diamond epitaxial deposition services. We grow defect-free, single-crystal diamond layers directly onto client-provided diamond seeds or specific engineered substrates. With atomic-level control over the plasma chemistry, we achieve pristine crystalline growth tailored for advanced R&D in solid-state physics, deep-UV LEDs, and experimental high-power diodes.

Specs & Tolerances

  • Impurity Levels: Sub-ppb for N and B
  • Growth Rate: Highly controlled for lattice perfection
  • Surface Finish: As-grown or CMP polished
  • Raman FWHM: < 1.5 cm⁻¹

Material Properties

  • Flawless continuation of seed crystal lattice
  • Customizable doping profiles layer-by-layer
  • Extreme purity for specialized research

Key Advantages

  • Provides a blank canvas for custom device fabrication
  • Enables multi-layer diamond semiconductor designs
  • Accelerates institutional R&D timelines

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